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  • Integrated Circuit (IC) Package Design

    We specialize in the design and development of IC package technology. Our designers can help get the IC package design done quickly and correctly so you can get your manufacturing started with little or no prototyping spins. If it works in the software simulation, it should work in real life. We have successfully completed 100+ designs in a varied number of technologies, and we have consulted on even more projects, working closely with most of the world's top semiconductor companies. Our areas of particular expertise in IC Package design include:
    1. - Data processing of I/O pad layouts
    2. - IC package planning and selection
    3. - Pad (bonding finger) layout
    4. - Substrate design and routing
    5. - Manufacturing and assembly simulation and optimization
    6. - IC package visualization

    Design Technology

    We believe that the IC package is a beautiful thing, and the design must reflect that. Our unique design tools are a blend of high-performance customized software and specially developed modeling engines. Working in concert, these design tools allows us to achieve results you may not be used to in your package design, including:
    1. - Support for almost any technology (BGA, CSP, SiP, Leadframes, Interposers, Heterogeneous Stacking, etc.)
    2. - 3D models of the IC package, even at the pre-design stage
    3. - 4D animations of the manufacturing/assembly process, using real manufacturing data
    4. - Unlimited geometric capability (circles, arcs, splines, etc.)